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Course Description



Quality labelled course   

Design for Electromagnetic Compatibility


Date: from 16 May 2000 to 18 May 2000

Duration 3 day(s)

Language English    Venue Portsmouth, UK

Country 

Course fee 850,00    Currency UK£    Discount Multiple

Description
Description

EMC requirements for electrical and electronic products are becoming important. Functional, regulatory, contractual and
liability issues oblige manufacturers to produce equipment which is compliant with strict EMC requirements.
As with all design considerations, significant time and money can be saved by addressing EMC early in the design process.
This 3 day course will show you how to achieve products which are right first time, by integrating EMC in all departments and
ensuring effective teamwork.
Course objectives:
- To ensure knowledge of EMC and understand how it affects electrotechnical products
- To understand how to apply this knowledge to enable cost effective and compliant design of products, systems and
installations.

Course Contents and Time Table
Day 1:
Characteristics of an electromagnetic interface signal
- sources of EMI
- analysis of EMI
- electrostatic (discharge) interference
Introduction to EMC
- electromagnetic compability
- approaches to EMC
- coupling mechanisms
- some fundamental concepts
Cables & coupling Mechanisms
- capacitive coupling
- inductive coupling
- the affect of impedance on coupling type
- shielding to prevent magnetic radiation
- shielding a sensitive system against magnetic fields
- shield (surface) transfer impedance
Cables and Coupling Mechanisms
- cable shield grounding
- components-axial cable crosstalk measurements
- components-axial cables versus shield twisted pair braided shields
- affect of "pigtails" on magnetic shielding
- ribbon cables
Day 2:
Radiation from Digital Circuits
- introduction
- basic radiating structures
- magnetic dipole radiation
- near and far-fields
- reflected radiation waves
- reducing current on long lines
- digital clock distribution
- power supply distribution
- by-pass capacitors
- cross grounding
- mother-board (backplane) layout
- multi-layer pcb
- ground plane slots
- segregation by logic speeds
- track discontinuities
Shielding Effectiveness and Gasketing Techniques
- introduction to shielding
- near and far field conditions
- screening parameters
- shielding effectiveness
- absorption losses
- absorption losses
- reflection losses
Shielding Effectiveness and Gasketing Techniques
- practical screening considerations
- EMI/RFI gaskets
- apertures
- seams
- waveguides
- conductive windows
Grounding, Bonding & Earthing
- bus-bars & bond straps
- signal grounds
- single ground systems
- mulit-point ground systems
- hybrid ground systems
- practical low frequency grounding
- an earthing policy
Day 3:
Electrostatic Discharge (ESD)
- introduction to ESD
- basic electrostatic process
- inductive charging
- capacitive charging
- typical ESD failure modes in devices
- static discharge
- ESD protection in equipment design
Suppression Devices
- introduction to suppression devices
- blocking function devices
- isolating function devices
- by-pass function devices
- limiting function devices
- contact protection
- transient suppression
- absorbing function devices
- examples of combination of suppressors in common use
Immunity
- introduction
- immunity testing
- radiated immunity
- conducted immunity
Spectrum Analyzers & EMI Receivers
- introduction
- signal analysis
- EMI measurements

Audience
The 3 day course is intended primarily for electrical/electronic engineers or senior technicians working in the design,
development, production engineering, testing, installation and maintenance of electrical and electronic equipment.

Lecturers
Christopher Edward Grimes (EMC Chief Consultant/Engineer for Assessment Services). Qualifications: HNC Electronics and
ONC Business Studies.

Kennet Webb (Principal EMC Consultant with Assessment Services). Qualifications: MSC in EMC and B.Sc in Electrical
Engineering.

Further information
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