Course Description

Duration 5 day(s)

Language English    Venue Ramsbury, Wiltshire UK

Country 

Course fee 1875,00    Currency UK£    Discount 30% for Europractice

Description
Overview
As part of Esperan`s drive to provide high quality training on all of the methodology issues in the design of today`s electronic systems, we have teamed up with Analytical Edge, a company specialising in training and consultancy for high speed PCB design.

The development of semiconductor technology has meant that fast edge speeds are now the norm for many standard digital device families, and their effects have to be considered in PCB design to maintain signal integrity, even at modest clock speeds. This unique course provides a fundamental first step in understanding and applying the principles of high-speed design to ensure signal integrity in PCBs, and gives participants a sound knowledge of basic techniques which they can apply immediately to benefit their designs. While EDA signal integrity tools are not required, this course provides an essential foundation necessary for successful application of such tools.

Course Contents and Time Table
Course Agenda
Day 1
1. Overview
· When is a design “high speed”?
· How industry drivers force high speed
· Signal integrity – definition
· How high speeds challenge signal integrity
· High speed PCB design – the issues
2. Fundamental electrical concepts
· Time and frequency - harmonic content of digital signal waveform
· Effective operating frequency
· Resistance, inductance and capacitance
· Transmission lines and wave propagation
· Current paths on a PCB – return current
· Attenuation of signals on lines – skin effect, loss tangent
· Coupling and crosstalk – mutual capacitance and mutual inductance
· Parts placement effects
3. Power distribution
· Power requirements
· Coping with changing currents
· Board level decoupling - limitations
· Component level decoupling
· Decoupling capacitors for high-speed devices
· Practical considerations for high-speed PCBs
Day 2
4. Impedance control
· Transmission lines – propagation delay, velocity, characteristic impedance
· Reflections from a terminated line – positive and negative
· Source reflections
· Dielectric properties – effective length and critical length
· Practical PCB transmission lines – microstrip, embedded microstrip, stripline and dual stripline
· Proximity effects
· Differential pairs
· Characteristic impedance range limits
· Types of terminations and their effects
5. Crosstalk
· Capacitive and inductive crosstalk
· Dependence on edge rate
· Coupling factor
· Ground plane effects
· Forward and backward crosstalk
· Crosstalk control in PCB design – parts, planes, tracks, connectors, terminations
6. Devices and models
· Device input/output characteristics
· Essential features of a device model
· Simple models
· Real device models
Day 3
7. Lines, loads and track routing
· Realising nets and buses with lumped, distributed and radial lines
· Discontinuities – reflections, critical length, connectors and vias
· Incident and reflected mode switching
· Overshoot and undershoot
· Effect of impedance and loading on signal propagation delay
· Load distribution and topology – merits of different schemes
· General routing and termination considerations
· Connectors for high-speed systems
8. PCB structure
· Merits of different layer stacks – number of layers, proximity of planes
· Fabrication considerations
· Process variables in PCB manufacture
· PCB materials – electrical and mechanical considerations
· Board thickness and tolerance
· Impedance testing
9. Course summary
· The challenge of high-speed design
· Building design experience
· Applying techniques and tools - the next stages
Day 4 - PCB materials for high-speed circuits
1. PCB material properties
· PCB material requirements for high-speed circuits
· Key laminate and cladding parameters
· FR-4 - the industry standard
· Epoxy fibreglass materials
· PTFE/ceramic materials
· Beyond FR-4 - routes to higher performance

2. Multilayer process
· Outline of multilayer process steps (including buried capacitance and microvias)
Day 4 - Minimising EMI through PCB design
1. EMC control
· EMC concerns for designers
· Why EMI has become a major issue
· EMI mechanisms
· The five factors in EMI analysis
· EMI from digital systems – what can we control?
· Worldwide regulatory requirements
2. Principles of EMI generation
· Electromagnetic wave propagation
· Near field and far field - the radiated signal
· Generation of RF fields on a PCB
· Differential mode and common mode current
· Differential mode and common mode radiation
Day 5 - Minimising EMI through PCB design (cont`d)
3. PCB structure
· Layer stacking in the PCB
· The 20-H rule
· Image planes
· RF current loops due to power and ground
· Grounding concepts and methods
· Electrically long tracks (l/20 rule)
· System partitioning – multipoint grounding
· Ground plane integrity
· Via properties
4. Components and EMC
· IC packaging
· Ground bounce
· Lead capacitance
· EMC techniques for large heatsinks
· Power line filtering
· EMC control at component level
5. Connectivity and interconnection
· Split planes
· Power plane filtering
· PCB with split planes – isolation and bridging
· Localised ground plane
· System interconnections – connectors, cables and backplanes
· RF coupling – PCB to PCB and PCB to cardcage
· Indirect multipoint grounding
· Backplane connectors and signal routing
6. Review and summary
· Other EMC factors – transmission lines, crosstalk, electrostatic discharge
· Review of EMI control principles
· Key areas for designers

Audience
The course is suitable for…

Digital design engineers who either have no experience of the background and methods required for high-speed PCB design, or who have some experience butwould benefit from a more complete and in-depth knowledge of the topics presented.

PCB designers working on digital boards where high-speed design rules are required.


Prerequisites
Participants should be familiar with basic electrical concepts. No prior knowledge of EDA design tools is required or assumed.

Lecturers
The lecturer Mr Bob Easson of Analytical Edge is also the author of this course and a guru in the area of High Speed and EMI PCB Design.

Further information
Esperan
Unit 1 Hilldrop Lane
Ramsbury
Wiltshire
SN8 2RB
UK

Tel +44(0)1672 520101
Fax +44(0)1672 521039

Email info@esperan.com