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Course Description
 | Silicon Micromachining |
Date: from 5 Oct 2000 to 6 Oct 2000
2 day(s)
English Chemnitz, Germany
613,00 EURO 30% for Academic members
Silicon Micromachining is a technology to structure silicon and thin films deposited
on top of silicon in order to fabricate miniature devices such as sensors and actuators,
passive structures and microsystems functioning in electromechanical and opto-electonic/
optomechanical systems. The key technologies (wet chemical etching of silicon (isotropic and
anisotropic),thin film deposition as important for micromachining, wafer bonding, dry etching
in particular reactive ion etching) andsurface micromachining) will be the subject of the
course. The course covers practical technological issues as well as the physical-chemical
background of the technological processes. The technology will be illustrated by numerous
examples, which are used to discuss the possibilities and the limits of the technology.
· Wet chemical anisotropic etching of silicon, including photolithography, properties of
single crystalline silicon, process description, etching solutions (KOH, EDP, TMAH),
wafer orientations, mask layout and materials, etch stop, corner compensation
· Isotropic wet chemical etching
· Chemical physics of wet chemical etching.
· Waferbonding, including silicon fusion bonding, anodic bonding, use of chemical mechanical
polishing for bonding, and
bonding using thin films. Criteria for bondability are discussed
· Application of bulk micromachining. Many examples of devices and systems manufactured using
the technology described so far
· Plasma Etching, with focus on deep reactive ion etching
· Surface micromachining, including thin film deposition techniques.
The course is devoted to engineers working or interested in the field of microsystem
technologies.
A course developed by the MESA+ institute at the University of Twente (NL).
Tutors : Prof. Dr. Miko Elwenspoek and Dr. Han Gardeniers
FSRM • Rue Jaquet-Droz 1
CH-2007 Neuchâtel
Tél +41 32 720 09 00
fsrm@fsrm.ch
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