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Course Description
 | An Introduction to High-Speed PCB Design Workshop |
Date: from 6 Aug 2001 to 8 Aug 2001
3 day(s)
English Wiltshire, England, UK
1200,00 UK£ Fee for EuroPractice members : 840 UK£
The development of semiconductor technology has meant that fast edge speeds are now the norm for many standard digital device families, and their effects have to be considered in PCB design to maintain signal integrity, even at modest clock speeds. This unique course provides a fundamental first step in understanding and applying the principles of high-speed design to ensure signal integrity in PCBs, and gives participants a sound knowledge of basic techniques which they can apply immediately to benefit their designs. While EDA signal integrity tools are not required, this course provides an essential foundation necessary for successful application of such tools.
The course emphasises the underlying physical principles and applying them to develop an understanding of the various aspects of high-speed design, from controlling line impedance and crosstalk to the effects of power distribution, decoupling, and the PCB layer structure, all from a practical viewpoint.
Uniquely, the course is liberally illustrated with examples and "what if" scenarios showing the effects of varying different parameters, enabling participants to develop an understanding of their relative importance and magnitude. Helpful guidelines on assessing and implementing best practice are included.
This course can also be taken in the following configurations:
- Introduction to VHDL Based Design - 2 days
- VHDL for Synthesis and Verification - 3 days
The course covers the following areas in detail:
-The impact, issues and challenges of high-speed design
-The underlying basic physical principles essential for understanding the issues and how to treat them
-How power distribution plays a key role
-The need for track impedance control and how to achieve it
-How to control crosstalk between PCB tracks
-The essential features of ICs for high-speed design, and of basic device models
-Strategies to realise nets and buses, with the merits of different routing and termination schemes
-How different PCB materials and layer stack-ups play a vital role
AGENDA
1. Overview
-When is a design "high speed"?
-How industry drivers force high speed
-Signal integrity - definition
-How high speeds challenge signal integrity
-High speed PCB design - the issues
2. Fundamental electrical concepts
-Time and frequency - harmonic content of digital signal waveform
-Effective operating frequency
-Resistance, inductance and capacitance
-Transmission lines and wave propagation
-Current paths on a PCB - return current
-Attenuation of signals on lines - skin effect, loss tangent
-Coupling and crosstalk - mutual capacitance and mutual inductance
-Parts placement effects
3. Power distribution
-Power requirements
-Coping with changing currents
-Board level decoupling - limitations
-Component level decoupling
-Decoupling capacitors for high-speed devices
-Practical considerations for high-speed PCBs
4. Impedance control
-Transmission lines - propagation delay, velocity, characteristic impedance
-Reflections from a terminated line - positive and negative
-Source reflections
-Dielectric properties - effective length and critical length
-Practical PCB transmission lines - microstrip, embedded microstrip, stripline and dual stripline
-Proximity effects
-Differential pairs
-Characteristic impedance range limits
-Types of terminations and their effects
5. Crosstalk
-Capacitive and inductive crosstalk
-Dependence on edge rate
-Coupling factor
-Ground plane effects
-Forward and backward crosstalk
-Crosstalk control in PCB design - parts, planes, tracks, connectors, terminations
6. Devices and models
-Device input/output characteristics
-Essential features of a device model
-Simple models
-Real device models
7. Lines, loads and track routing
-Realising nets and buses with lumped, distributed and radial lines
-Discontinuities - reflections, critical length, connectors and vias
-Incident and reflected mode switching
-Overshoot and undershoot
-Effect of impedance and loading on signal propagation delay
-Load distribution and topology - merits of different schemes
-General routing and termination considerations
-Connectors for high-speed systems
8. PCB structure
-Merits of different layer stacks - number of layers, proximity of planes
-Fabrication considerations
-Process variables in PCB manufacture
-PCB materials - electrical and mechanical considerations
-Board thickness and tolerance
-Impedance testing
9. Course summary
-The challenge of high-speed design
-Building design experience
-Applying techniques and tools - the next stages
Digital design engineers who either have no experience of the background and methods required for high-speed PCB design, or who have some experience but would benefit from a more complete and in-depth knowledge of signal integrity issues and possible design techniques.
PCB designers working on digital boards where high-speed design rules governing track impedance control, line terminations, routing to minimise noise coupling etc. are required.
Prerequisites Participants should be familiar with basic electrical concepts.
No prior knowledge of EDA design tools is required or assumed
Gill Loader at Esperan on telephone number
+44 1672 520101 or email us at info@esperan.com
Or follow the link below.
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