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Course Description
 | Basics of Microelectronics Packaging |
Date: from 29 Sep 2003 to 2 Oct 2003
4 day(s)
English Amsterdam, The Netherlands
2445,00 USD $2355 for 2 or more from same company
The course introduces the developments in connectivity from the semiconductor chip outwards, and explores the use of plastic encapsulating materials and methods to lead into the main body of the course. Packaging developments that are addressed in the main course include chip scale and high density multi-chip packaging and the use of various chip attachment microjoining techniques such as die bonding, wire-bonding, direct chip attach by tape automated and flip chip bonding. The approaches to underfilling and encapsulating high density assemblies are tackled from a modern packaging engineers’ viewpoint, with useful briefing of the materials and techniques to serve as an ongoing practical reference. Thermal design solutions, which are essential for modern high density systems, are provided. World expert insight provides in-depth understanding of reliability behavior and reliability characterization and design for global applications of electronics, for those in industrial as well as military and aerospace businesses. The instructors have an extensive depth of industrial experience to benefit those attending the course.
Microelectronics Markets:
An overview
Evolution of Microelectronics Packaging:
Packaging requirements, chip reliability development; Passivation;
Metallization; Chip preparation and encapsulation for junction
coating; Evolution DIPS to chip carriers; Reliable micropackaging
Basics of Encapsulating Materials:
Basics of materials for moulding and casting: Materials
thermoplastics and thermosets; Organic and inorganic inclusions;
Formulation; Chemistry; Characterization and assessment
Basics of Moulding and Encapsulation:
Materials preparation; Use and merits of fillers; Mixing;Tooling
An Engineer’s Approach to Encapsulation and Underfill:
Glob-top and underfill encapsulation; Properties of resin
encapsulants; Failure mechanisms in encapsulated devices; Material
properties required of encapsulants; Processing of materials; New
developments in encapsulant and underfill technology
Packaging of Chips and Subcircuits:
Chip scale packaging and ball grid arrays
Packaging of Chips and Subcircuits:
Multi-chip module overview;Testability
Microjoining and Bonding:
Die attachment;Wirebonding by ultrasonic, thermosonic and
thermocompression methods;Wedge and ball bonding of
aluminum and gold wires; Bonding reliability
Direct Chip Attach:
Tape automated bonding; Flip chip
Microelectronics Reliability:
Quality and reliability concepts; Requirements and theory
Microelectronics Reliability:
Reliability regimes and the bathtub curve—infant mortalities, burnin
and ESS, random failures, wearout—methods of assessment;
Accelerated aging; Arrhenius and HAST; Hermetic vs plastic;
Devices and passives; Case study solutions; Reliability indicators;
Materials specifications
Thermal Design and Management:
Analyzing requirements; Fundamentals of heat flow—conduction,
convection and radiation; Linear and three-dimensional heat flow;
Steady-state and transient events; Practical considerations for
packages, special solutions
Personnel involved in the design, manufacture, quality control, purchasing or servicing of electronic equipment, as well as those involved in the technology of integrated circuits, should benefit from this course. Companies providing products and services to the electronics industry should become aware of the needs and opportunities in this field through participation in the course. Upon completion of this course, you will have an understanding of microelectronics packaging technologies and trends including joining, bonding, thermal analysis and reliability assessment.
Prof. Nihal Sinnadurai is a Senior Expert of the UN Development Programme (UNDP) and the International Telecommunications Union (ITU) since 1982 for whom he has undertaken missions on technology transfer and skill training in electronics technology, quality and reliability. He was also Professor of Microelectronics and continues to be a visiting academic in the UK and USA. His inventions include the HAST non-saturating autoclave test system and liquid crystal micro-thermography. He has authored over 80 papers and contributed to 6 books in the field of technology and reliability. Nihal Sinnadurai is Director and Principal Engineer of ATTAC. He holds a Bachelors and Masters in Physics and Semiconductor Physics and a Ph.D. for original work on Reliability Engineering. He is a Chartered Engineer Fellow of the Institute of Physics and the Institute of Electrical and Electronic Engineering and Chairman of the International Microelectronics and Packaging Society (IMAPS).
The Center for Professional Advancement
www.cfpa.com
+31/20/638.28.06
amsterdam@cfpa.com
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