Course Description

Duration 2 day(s)

Language English    Venue Cambridge, UK

Country 

Discount IMAP`s, WJS and TWI Industrial Members 5%

Description
Adhesives are increasingly being used in microelectronics packaging and assembly, and are often an integral part of the packaged assembly. This course is unique in combining the practical aspects of adhesive technology for microelectronics, and will teach best practice in the use of adhesives for microelectronics packaging, ensuring optimum levels of production efficiency, quality and safety.

Tailored courses can be arranged for specific customer requirements, structured in line with company needs. Both theoretical and practical training for small groups can be designed to suit your particular manufacturing route. You may either come to TWI with full use of the specialist facilities, or choose in-house training at your premises with your equipment and facilities.

Course Contents and Time Table
Application of adhesives in microelectronics
- component attachment
- solder replacement
- die attach
- flip-chip encapsulation
- opto-electronic components

Processing
- dispense methods
- equipment
- curing methods

Materials handling
- safety precautions
- storage
- disposal

Design of adhesively bonded joints

Quality & reliability
- failure mechanisms
- factors controlling yield
- test/inspection methods

Finite element analysis of bonded joints

Practical demonstration
- dispense methods
- component/die attachment
- glob-top encapsulation
- flip-chip bonding
- light cure
- methods for inspection/test

Audience
Process/manufacturing engineers, production operators, technicians and supervisors requiring the knowledge in electronics assemblies from consumer electronics through to demanding aerospace conditions.

Lecturers
Course Manager: Dr Medhi Tavakoli is a Technology Manager at TWI with over 16 years experience of polymeric materials, he researches novel surface preparation techniques for industry.
Prof. Nihal Sinnadurai is a Principal Consultant for TWI. A UN expert on technology transfer in electronics technology and reliability, he has previously worked as a scientist, engineer and manager for British Telecommunications.

Further information
For more information or to book please contact Lezli Furness at: trainexam@twi.co.uk